JH-2521Diamond Wire Cutting Fluid is a new type of product, it is mainly used for cutting process of all kinds of hard brittle materials(monocrystalline silicon, polycrystalline silicon, germanium, gallium arsenide, quartz, indium gallium nitride, gems, non-metallic materials, etc.), the features of excellent lubrication,coo ling,corrosion resistance,rust resistance and hydrogen inhibition function. The silicon surface TTV after cutting is small without wire mark and can prolong the life of diamond wire.
Product Features: 1. Contains unique chemical cleaning additives, so that the silicon wafer is very clean after cutting,easy to clean after cutting. 2. Contains unique chemical cleaning additives, so that the silicon wafer is very clean after cutting,easy to clean after cutting. 3. Less foam,easy to use. 4. Unique suspension property,avoid silicon powder deposition block machine pipeline.
Application method: This product use concentration from 0.2% to 0.5%, according to the specific process appropriate adjustments. Package,transportation and storage: 1kg/barrel,25kg/barrel Storage in ventilation, cool, dry place
Notes: 1. Storage in the process of prevent oil mixed with water, otherwise may cause product deterioration. 2. If the liquid color getting darker durings storage or in the process of using,does not affect the use effect. 3. Do not eat,rinse it with clean water immediately if it gets into eyes accidentally. serious hospital for treatment.
Colorless to yellowish liquid
Minimum Order Quantity:50 Kilograms Packaging Details:1kg/barrel,25kg/barrel Delivery Time: Ten days after receipt of advance payment Supply Ability:1 Ton per Day